multilayer ceramic chip capacitors 1 of 3 creation date : may 19, 2017 (gmt) c2012x7r1h225m125ac tdk item description c2012x7r1h225mt**** applications commercial grade feature general general (up to 50v) series c2012 [eia 0805] status production size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 2.2f 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 227m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 19, 2017 (gmt) c2012x7r1h225m125ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c2012x7r1h225m125ac esr c2012x7r1h225m125ac capacitance c2012x7r1h225m125ac dc bias characteristic c2012x7r1h225m125ac temperature characteristic c2012x7r1h225m125ac(no bias) c2012x7r1h225m125ac(dc bias = 25v ) ripple temperature rising c2012x7r1h225m125ac(100khz) c2012x7r1h225m125ac(500khz) c2012x7r1h225m125ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 19, 2017 (gmt) c2012x7r1h225m125ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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